Shanghai’s new policy for the smart terminal industry has been released, accelerating technological breakthroughs in high-end chips such as CPU chips and MCU chips

The General Office of the Shanghai Municipal People’s Government issued the “Shanghai Action Plan for Promoting the High-Quality Development of the Intelligent Terminal Industry (2022-2025)” (hereinafter referred to as the “Action Plan”), proposing that by 2025, the scale of Shanghai’s intelligent terminal industry will exceed 700 billion yuan, There should be no less than 2 companies with a revenue of 100 billion, not less than 5 companies with a revenue of 10 billion, and not less than 20 companies with a revenue of 1 billion. No less than 200 new smart factories will be added, and 100% of OEMs will reach the level of smart factories.

The “Action Plan” clarifies the main tasks, including intelligent networked vehicles, intelligent robots, virtual reality interactive terminals, smart home terminals, smart wearable terminals, Xinchuang terminals, and basic software and hardware support systems.

Intelligent connected car
Internet of Vehicles nurturing action. Build a new industrial chain system around the core systems of intelligent driving, intelligent networking and intelligent cockpit. Promote the iterative upgrade of the intelligent driving system, cultivate full-stack solution providers, and expand the coverage of intelligent driving scenarios; strengthen the research and development of intelligent networked systems, carry out the verification of vehicle-road coordination technology, and accelerate the application of the Internet of Vehicles in mass-produced models; Cockpit integration research and development, promote the integrated development of cockpit and content providers, and create an integrated smart cockpit. Vigorously develop terminal components, focus on key components such as lidar, central domain controller and other core components for environmental perception and intelligent decision-making, and accelerate the implementation of industrial support; promote the large-scale application of in-vehicle computing platforms and artificial intelligence chips; improve drive-by-wire and braking Integration level, accelerate the formation of large-scale controller mass production capacity. Focusing on the collaborative requirements of the intelligent networked “people-vehicle-road-cloud” system, a batch of new intelligent road infrastructures with functions such as environmental status detection, traffic participant identification, and traffic flow monitoring will be deployed, and a batch of smart transportation demonstration roads will be built. ; Launch a new generation of vehicle wireless communication network application pilots, and promote enterprises to build a 5G vehicle networking communication environment.

Coordinate industrial ecological construction actions. Based on the link between vehicle integration and software platform, promote cooperation between vehicle enterprises and technology companies, social platforms, etc., promote the coordinated development of integrated circuits, software, communications and other industries, cultivate new formats such as smart travel and data services, and promote intelligent network connection. The integrated development of automobile terminals, smart tourism and smart commerce. Create a group of intelligent networked automobile industry clusters with complementary positioning and agglomeration of elements. Pudong will focus on the development of the Internet of Vehicles, vehicle operating systems and automotive chips, etc., to create a highland for the development of the core component industry; Jiading will build a comprehensive demonstration area integrating R&D, manufacturing, application, testing and certification of intelligent connected vehicles; Lingang Construction An intelligent networked vehicle manufacturing and export base with international influence. Accelerate the construction of public service platforms such as the Internet of Vehicles Information Security Laboratory, and promote third-party institutions to establish the testing and certification capabilities of intelligent and connected vehicles; build an industrial exchange, cooperation and display platform, and hold events such as terminal product release and application launch to promote talent and industry agglomeration .

smart robot
Promote breakthroughs in core technologies. Focusing on the three major systems of motion, perception and control, organize key component research projects, break through hardware systems such as high-performance motors, reducers, and controllers, and tackle software technologies such as cloud brain, knowledge engine, self-learning, and human-computer interaction. Aiming at intelligent cloud systems, chips, intelligent sensors and other fields, to seize the high ground of intelligent robot industry.

virtual reality interactive terminal
Improve the maturity of virtual reality hardware. Focusing on key technologies such as near-eye display, perceptual interaction, network transmission, and rendering processing, comprehensively improve indicators such as terminal power consumption, portability, and computing power, and promote breakthroughs in key links such as near-eye display screens, perceptual interaction devices, and development tools.

Xinchuang Terminal
Promote the breakthrough development of Xinchuang products. Relying on the advantages of domestic central processing units (CPUs) and focusing on industrial clusters such as Songjiang Xinchuang Industrial Park, support enterprises in the fields of finance, medical care, etc., focusing on the development of server and personal computer products used in edge computing, data centers and other fields, to create market acceptance A product system with high degree, strong brand competitiveness and excellent performance indicators.

Software and hardware basic support system
Improve core chip support capabilities. Accelerate technological breakthroughs in high-end chips such as mobile phone processor chips, high-performance central processing unit (CPU) chips, and automotive-grade micro-control unit (MCU) chips, and improve wafer manufacturing capabilities with advanced technology and characteristic technology.

Improve the technical capabilities of key components. Support breakthroughs in core components such as “three electrics” and “three intelligences” of intelligent networked vehicles, develop 5G communication modules, optical modules and other components, and speed up micro-organic light-emitting displays (Micro-OLED), micro-luminescent displays (Micro-LED), etc. Research and application of new display technologies, and promote the development of intelligent sensors such as biological signs, environmental perception, and image acquisition.

Accelerate the layout of industry software. Develop real-time operating systems for the automotive and industrial control fields, and achieve breakthroughs in key links such as Electronic Design Automation (EDA), Assisted Analysis (CAE), and Assisted Manufacturing (CAM). Strengthen system reliability and security, and form a new supply of industry software for scenario-based, digital, and intelligent three-tier architectures.

Speed ​​up the layout of basic software. Promote the development of basic software such as operating systems, distributed databases and middleware. Focus on key technologies such as instruction set and kernel architecture to improve product energy level. Actively promote the research on cutting-edge technologies such as cloud native and multi-source heterogeneous data processing.